Looking for top-quality UV Laser Marking Machine? Look no further than our factory. We offer custom solutions that are guaranteed to meet your needs. Contact us today!
3W Inggu air cooling,5W Huaray water cooling,10W 15W USA AOC water cooling
Application
Metal and nonmetal
Marking Speed
7000mm/second
Indicate light
Double red light
Repeated Precision
±0.003mm
Marking line width
0.01mm
Working voltage
110V~220V /50~60HZ
Cooling Mode
Water Cooling
Supported graphic formats
AI，BMP，DST，DWG，DXF，DXP，LAS，PLT
Support operation system
Win7/8/10 system
Controlling software
EZCAD
Goggles,foot switch,Ruler ,Udisk, data cable and other fix tools
Optional parts
Rotary Device, Lift platform, other customized Automation
Package
Wooden package
UV laser is cold light source . UV laser with short wavelength , focus , smaller spot , belongs to cold process with a little heat affecting , good beam quality , it can achieve perfect marking . Most materials can absorb ultraviolet laser , it is widely applied on industrial ; with very little heat affecting area , it won't have heat effect , there is no burning problem , pollution-free , non-toxic , high marking speed , high efficiency , the machine performance is stable, low power consumption.2. Mainly used in the high-end market of ultra-fine processing, marking the surface of packaging bottles of medicine, cosmetics, video and other polymer materials, the effect is very fine, the marking is firm and clean, better than ink coding and pollution-free; flexible pcb board marking Marking, dicing; silicon wafer micro-hole and blind-hole processing; LCD liquid crystal glass two-dimensional code marking, glassware surface drilling, metal surface coating marking, plastic buttons, electronic components, gifts, communication equipment, building materialsUV laser marking machine industry application: 1.355nm ultraviolet light focusing spot is very small, which greatly reduces the mechanical deformation of the material (cold light), because it is mainly used for ultra-fine marking and engraving, especially suitable for food, pharmaceutical packaging materials marking, micro-holes, glass High-speed division of materials and complex pattern cutting of silicon wafers and other application industries.
